LSP1000 ? lsp1012 microsemi microwave products 75 technology drive, lowell, ma. 01851, 978-442-5600, fax: 978-937-3748 page 1 www. microsemi .com copyright ? 2007 rev: 2009-09-10 rohs com p liant enhanced performance surface mount epsm ? pin diodes tm ? description the lsp series of enhanced performance surface mount (epsm) pin diodes offers the circuit designer a higher level of quality in a commercially priced package. choose from LSP1000, lsp1004, and lsp1008 for switching applications, lsp1002, lsp1005, lsp1010 and lsp1011 for low dist ortion attenuation from vhf through 5 ghz. they are available in a host of configurations (see configuration table for internal wiring.) the lsp products are supplied with a rohs compliant gold finish. other configurations are available - consult factory for details. when ordering specify configuration (example: lsp1004-454-4 is a common cathode dual pin). applications/benefits ? high performance wireless surface mount options for gsm, tags, wans, pcs ? wideband switching ? broadband attenuators ? phase shifters ? broadband limiters applications specify epsm package style 450a or 454. for 3 terminal style 454, refer to configuration page. example: lsp1001-454-4 is a common cathode pair of pin diodes for broadband switching applications; for the 2 terminal style 450a, refer to the outline dimension table. example: lsp1001-450a is a single device with a 0.075 x 0.050 outline. a bsolute maximum ratings at 25o c (unless otherwise specified) rating symbol value unit maximum leakage current @80% of minimum rated v b i r 50 na storage temperature t stg -65 to +125 oc operating temperature t op -65 to +125 oc power dissipation p d 500 mw forward current (1us pusle) i f 1 a key features ? low cost ? high performance ? surface mount ? available on tape ? multiple configurations to choose from ? rohs compliant 1 important: for the most current data, consult our website : www.microsemi.com specifications are subject to change, consult factory for the latest information. these devices are esd sensitive and mu st be handled using esd precautions. 1 the epsm products are supplied with a rohs complaint gold finish . l l s s p p 1 1 0 0 0 0 0 0 - - l l s s p p 1 1 0 0 1 1 2 2
LSP1000 ? lsp1012 microsemi microwave products 75 technology drive, lowell, ma. 01851, 978-442-5600, fax: 978-937-3748 page 2 www. microsemi .com copyright ? 2007 rev: 2009-09-10 rohs com p liant enhanced performance surface mount epsm ? pin diodes tm ? epsm pin diodes . electrical parameters @ 25 ? c (unless otherwise specified) model number v b (v) ir=10 a (min) c t (pf) 1 @v r (max) v r (v) r s (ohms) 2 @i f (max) i f (ma) t l (ns) 3 (typ) application LSP1000 35 0.28 5 2.5 5 80 switch lsp1002 100 0.32 50 4. 0 100 1500 attenuator lsp1004 35 0.75 20 0.6 10 150 switch lsp1011 200 0.35 50 2. 0 100 2000 attenuator lsp1012 20 0.35 10 1.8 10 5 limiter typical pinout for 454-x package style 454-0 454-1 454-2 454-3 454-4 454-5 notes 1. capacitance (c t ) is measured at f = 1 mhz 2. series resistance (r s ) is measured at f = 100 mhz a. the lsp1012 is measured at f = 1ghz 3. carrier lifetime (t l ) is measured at i f = 10 ma, i r = 6 ma e e l l e e c c t t r r i i c c a a l l
LSP1000 ? lsp1012 microsemi microwave products 75 technology drive, lowell, ma. 01851, 978-442-5600, fax: 978-937-3748 page 3 www. microsemi .com copyright ? 2007 rev: 2009-09-10 rohs com p liant enhanced performance surface mount epsm ? pin diodes tm ? mechanical options epsm products are available in a broad range of mechan ical configurations. the st andard package style is the 450 series. this series has several sizes av ailable to accommodate the internal chip configurations. the 450a is the most common configuration for single diode applications. the 454 series package style is a three terminal configuration designed to accommodate 2 chip for ?t? and common anode/ca thode designs. with uniform ?flat-top? construction, the 450 series of epsm products are ideally su ited for tape and reel / automated assembly. the 150 series of epsm products have a ?glob-top? construction and are traditionally used in smaller volume applications. package style 150x package stye 450x package style 154 package stype 454 m m e e c c h h a a n n i i c c a a l l
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